TSMC and Amkor Technology signed a 10-year pact to grow advanced semiconductor packaging operations in Arizona. The partnership finishes more of the chip supply chain on US soil while supporting TSMC's targeted multi-billion-dollar spending in the state.
The packaging collaboration adds critical back-end processes next to its front-end wafer fabs, thereby completing a fuller domestic supply chain.
The arrangement represents a major advance for on-shore semiconductor infrastructure.
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AUO's board approved selling its Taichung Plant Phase II buildings, cleanrooms and facility equipment in Xitun District to TSMC for NT$38.8 billion (about US$1.2 billion) before tax, per AUO's TWSE material-information filing as reported by TechNews and DigiTimes. AUO expects a disposal gain of about NT$18.5 billion, with payment in installments under the property contract. Separately, AUO ended a planned NT$19.7 billion sale of its Huaya site to Quanta because the two sides could not agree on specs and delivery timing.
GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
Sources told CNBC that Chinese AI lab Moonshot has discussed leasing Nvidia Blackwell capacity from European neoclouds, including talks around clusters of 8,000 or more GPUs. No signed lease has been confirmed.
Semiconductor Engineering's week in review: HBM smuggling into China, roughly 600,000 Nvidia H200s held in Hong Kong, a reportedly paused Micron Taiwan plant, and Oracle's reported cancelation of a ~$7B Tencent chip-access deal.
Powerchip Investment Holding filed a criminal complaint on Nov. 2 over an alleged coordinated bid to buy a 20% stake for more than NT$13.6 billion. The filing raises questions about compliance with tender offer rules and the origin of the funds.
