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Multiple outlets including Seeking Alpha, Financial Times and iConnect007 confirm TSMC and Amkor's 10-year Arizona packaging agreement announced June 16, 2026.

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Home/Tech/TSMC inks decade-long pact with Amkor for Arizona packaging plant
VERIFIEDBy Xavier Rivera· ·1 min read

TSMC inks decade-long pact with Amkor for Arizona packaging plant

TSMC and Amkor Technology signed a 10-year pact to grow advanced semiconductor packaging operations in Arizona. The partnership finishes more of the chip supply chain on US soil while supporting TSMC's targeted multi-billion-dollar spending in the state.

Source:DigiTimes Asia
Post
TSMC inks decade-long pact with Amkor for Arizona packaging plant
TL;DRAI · 60 sec read

TSMC signs a 10-year agreement with Amkor Technology for advanced chip packaging and testing services near Phoenix. Amkor will open a $7 billion facility in Peoria, Arizona, with production starting in 2028. The pact adds back-end processes next to TSMC's wafer fabs, completing more of the semiconductor supply chain inside the United States.

TSMC has reached a 10-year pact with Amkor Technology that will expand advanced chip packaging operations on American territory.

TSMC and Amkor establish long-term packaging partnership in the US. The two parties signed the agreement on June 16, 2026, creating a framework under which TSMC will obtain advanced packaging and testing services from Amkor at jointly developed sites near Phoenix.
The packaging collaboration adds critical back-end processes next to its front-end wafer fabs, thereby completing a fuller domestic supply chain.

Amkor is constructing an advanced packaging and test campus in Peoria, Arizona, backed by the CHIPS Act. Output at the $7 billion site is scheduled to begin in early 2028.
POST FROM @AmkorTechnology· Official announcement tweet from Amkor Technology confirming the 10-year strategic agreement with TSMC for advanced packaging in Arizona
https://x.com/AmkorTechnology/status/2066872267087171638

TSMC deepens its Arizona footprint beyond wafer fabrication. TSMC is targeting more than $100 billion in Arizona fabs according to previously reported plans. The packaging collaboration adds critical back-end processes next to its front-end wafer fabs, thereby completing a fuller domestic supply chain.
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The arrangement represents a major advance for on-shore semiconductor infrastructure. It dovetails with wider initiatives aimed at reinforcing the American chip sector.
The arrangement represents a major advance for on-shore semiconductor infrastructure.
Agreement creates framework for expanded US capacity. Various reports indicate the alliance centers on sophisticated packaging methods essential for cutting-edge processors. The extended timeframe supplies both firms with predictability as they ramp up Arizona activities through the next ten years.
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