TSMC and Amkor Technology signed a 10-year pact to grow advanced semiconductor packaging operations in Arizona. The partnership finishes more of the chip supply chain on US soil while supporting TSMC's targeted multi-billion-dollar spending in the state.
The packaging collaboration adds critical back-end processes next to its front-end wafer fabs, thereby completing a fuller domestic supply chain.
https://x.com/AmkorTechnology/status/2066872267087171638
The arrangement represents a major advance for on-shore semiconductor infrastructure.
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