TSMC and Amkor Technology signed a 10-year pact to grow advanced semiconductor packaging operations in Arizona. The partnership finishes more of the chip supply chain on US soil while supporting TSMC's targeted multi-billion-dollar spending in the state.
The packaging collaboration adds critical back-end processes next to its front-end wafer fabs, thereby completing a fuller domestic supply chain.
https://x.com/AmkorTechnology/status/2066872267087171638
The arrangement represents a major advance for on-shore semiconductor infrastructure.
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TSMC posted a 77.4% year-on-year profit increase to NT$706.56 billion and raised its capital spending outlook while announcing another $100 billion for Arizona fabs. The results underscore sustained AI demand that now dominates 66% of its platform revenue.
King Yuan Electronics approved a $1.4 billion investment for a US semiconductor testing plant on July 10. The project, its largest overseas expansion, aims to address the growing US gap in backend packaging and testing capacity amid domestic manufacturing initiatives.
TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its upbeat guidance amid AI demand and other factors. Investors will watch for upgrades to revenue, spending, and margin targets as the AI boom's longevity comes under scrutiny.
Taiwan's Department of Investment Review has approved TSMC's US$20 billion capital injection into its US subsidiary TSMC Arizona. The approval clears the way for the semiconductor foundry to expand its manufacturing operations in the United States.
Infineon opened its €5 billion ($5.7 billion) Smart Power Fab in Dresden on July 2, 2026, three months early. The EU-supported factory will make power-management chips for electric vehicles, renewable energy and AI data centres while advancing Europe's target of doubling its global semiconductor share to 20 percent by 2030. Construction began in May 2023.
