Germany's District Court Munich I ruled on June 18, 2026 that Innoscience infringed Infineon Technologies' gallium nitride patents, barring imports and sales in Germany while ordering damages. The decision is reported as Infineon's fourth German patent victory as the GaN legal battle spreads to Shanghai.
The court delivered what reports describe as the fourth victory for Infineon in the GaN patent dispute.
The gallium nitride patent battle has escalated to Shanghai.
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Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
DigiTimes: ByteDance is in advanced talks with MediaTek to buy custom data center chips, and an agreement could come soon, according to people familiar with the matter. Bloomberg first reported the talks, saying a deal would help MediaTek compete with Qualcomm and Broadcom in data centers.
GlobalFoundries will operate up to two new chip fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion, with Japan supplying the money. The first fab, about $10 billion, is due online in 2029; a second, about $10 billion more, is still subject to approval.
Ecosia dropped Mistral after five months while Qualcomm and Huawei reached a new patent agreement, with the financial balance reportedly favoring Huawei. Free also set an early 2027 date for its next TV player after years of delays.
GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
