Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
Advanced packaging draws equipment makers as transistor scaling grows costlier.
ASML would compete with Besi and other front-end suppliers.
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GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
ASML confirmed on July 15 that Intel Foundry shipped the first high-volume logic product made with High-NA EUV lithography for Panther Lake. The milestone advances commercial readiness of the technology while ASML prepares TSMC and Samsung for wider adoption.
DigiTimes: ByteDance is in advanced talks with MediaTek to buy custom data center chips, and an agreement could come soon, according to people familiar with the matter. Bloomberg first reported the talks, saying a deal would help MediaTek compete with Qualcomm and Broadcom in data centers.
GlobalFoundries will operate up to two new chip fabs at its Malta, New York, site under a U.S.-Japan initiative providing up to $21 billion, with Japan supplying the money. The first fab, about $10 billion, is due online in 2029; a second, about $10 billion more, is still subject to approval.
Marvell Technology raised its fiscal 2028 revenue outlook to approximately $20 billion and set a fiscal 2031 target of $70-90 billion. The increases reflect expected growth in AI networking and optical connectivity demand.
