AUO's board approved selling its Taichung Plant Phase II buildings, cleanrooms and facility equipment in Xitun District to TSMC for NT$38.8 billion (about US$1.2 billion) before tax, per AUO's TWSE material-information filing as reported by TechNews and DigiTimes. AUO expects a disposal gain of about NT$18.5 billion, with payment in installments under the property contract. Separately, AUO ended a planned NT$19.7 billion sale of its Huaya site to Quanta because the two sides could not agree on specs and delivery timing.
AUO estimates a disposal gain of about NT$18.5 billion from the sale, according to the filing as reported by both outlets.
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GlobalFoundries signed a multi-year US$2 billion agreement with TSMC on October 8, 2026 to manufacture silicon interposers at its Malta, New York fab. The deal creates the first US-based source of silicon interposers for TSMC's CoWoS advanced packaging ecosystem.
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Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
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