MediaTek finalized pricing of a record US$3.9 billion overseas convertible bond on August 31, 2026, with Nvidia reportedly subscribing to US$3.5 billion or roughly 90 percent of the total. The issuance, which exceeds NT$120 billion, is described by the company as the largest overseas CB ever from a Taiwanese issuer.
The convertible bond structure gives Nvidia potential equity upside in MediaTek while providing the Taiwanese chip designer with fresh capital.
https://x.com/MediaTek/status/2094433280552562873
MediaTek and Nvidia have collaborated on multiple silicon projects in recent years.
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Patent filings analyzed by SemiAnalysis show ASML developing a die-to-wafer hybrid bonder for advanced packaging. The move positions the lithography leader against Besi and other suppliers as chipmakers seek growth beyond transistor scaling.
DigiTimes: ByteDance is in advanced talks with MediaTek to buy custom data center chips, and an agreement could come soon, according to people familiar with the matter. Bloomberg first reported the talks, saying a deal would help MediaTek compete with Qualcomm and Broadcom in data centers.
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